Home All Products BGA Reballing Stencil for CPU Repair with Tin Mesh Support for Qualcomm MTK and Snapdragon Processors
Product Attributes

BGA Reballing Stencil for CPU Repair with Tin Mesh Support for Qualcomm MTK and Snapdragon Processors

Price
${elevationList.prices_type2.min?'$'+elevationList.prices_type2.min:''} ${elevationList.prices_type2.min && elevationList.prices_type2.max?'~':''} ${elevationList.prices_type2.max?'$'+elevationList.prices_type2.max:''}
Price ${elevationList.prices_type2?'$'+elevationList.prices_type2:''}
≥${item.min_order} piece
$${item.price}
SKU: ${elevationList.model_no} Min Order: ${elevationList.min_order} piece


Contact Us
Comments
Send
Contact Us
Send